Enable high plating rates and superior step coverage with our advanced, cost-effective solutions for MEMS fabrication.
Our MEMS solutions deliver superior purity, solderability, and conductivity for semiconductor applications. With high plating rates and enhanced step coverage, costs can be reduced, and performance improved in micro-electromechanical systems.
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Optimize via step coverage, yield, and reliability for power/RF with our solutions that integrate seamlessly with die attach material.
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Learn MoreDesign next-generation Fan-Out Wafer Level Packaging (FOWLP) with our advanced gold and palladium solutions for thin metal films.
Learn MoreEnsure precise, uniform gold seed removal on TiW barriers with advanced, cost-effective gold etchants for semiconductor fabrication.
Learn MoreEnhance solderability and conductivity with high-purity deposits, seed filling, and adjustable roughness for advanced semiconductors.
Learn MoreIntegrated Solutions
Our complete range of pre-plate, strike and plating solutions ensure that you achieve superior results for your compound semiconductor applications.
Sustainability
Non-cyanide gold plating solutions to support Environment Health & Safety (EH&S) goals and maintain performance in compound semiconductor applications.
Reliability
Achieve unmatched corrosion resistance, high thermal stability and improved adhesion with our portfolio of compound semiconductor solutions.
MEMS technology is used across various industries, including automotive (for airbags and sensors), consumer electronics (smartphones, wearables), medical devices (sensors, diagnostic tools), industrial automation, and wafer level electrical test contacts. MEMS have become indispensable in the integration and production of many advanced semiconductor technologies.
Our electroplating solutions for micro-electromechanical systems (MEMS) offer superior physical properties that are critical to the function of the MEMS device. Critical physical properties can be different for differing device types. Common critical properties include physical strength, electrical resistivity, as well as resistance to corrosion. Common electroplated MEMS solutions include gold, palladium, palladium alloys, rhodium, and copper.
Our MEMS electroplating solutions offer high plating rates (> 0.5µm/min) and consistent physical properties. It is common for MEMS devices to require much thicker deposits than commonly found on other wafer level electroplated features. The thickness requirements for MEMS will demand high-speed chemistries in order to reduce cycle times.
Our electroplating solutions used in MEMS devices deliver superior physical and electrical characteristics over the bath life of the chemistry. It is important for the critical material property to be consistent in order for device performance to be consistent. Our electroplated MEMS solutions have been validated and proven over decades of experience.
