Enable next-generation fan-out wafer level packaging with our advanced gold and palladium solutions for thin metal films.
Our gold and palladium strike plating processes improve adhesion of subsequent electroplated layers. As a stand-alone layer, they enable the economic use of precious metals such as gold or palladium in the formation of solderable surfaces.
The thin layers of gold or palladium form low porosity films and provide protection of underlying metal from oxygen exposure and oxide formation detrimental to soldering. These features enable reliable soldering operations in high density chip designs.
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Learn MoreIntegrated Solutions
Our complete range of pre-plate, strike and plating solutions ensure that you achieve superior results for compound semiconductor applications.
Sustainability
Non-cyanide gold plating solutions help meet Environment Health & Safety (EH&S) goals while maintaining performance in compound semiconductor applications.
Reliability
Achieve unmatched corrosion resistance, high thermal stability and improved adhesion with our portfolio of compound semiconductor solutions.
FOWLP is an advanced packaging technology that expands wafer level packaging, enabling high-density I/O and smaller, more compact packages.
Our thin gold & palladium solutions improve adhesion of subsequent electroplated films, and as a stand alone finish, prevent oxide contamination of underlying metals, like nickel. These features enable greater process stability during soldering.
The use of precious metals such as gold or palladium is traditionally thought to be cost-prohibitive in high-volume semiconductor applications. The ability of our strike solutions to operate at low metal concentrations, as well as deliver the needed protection against oxides with minimal thickness requirements, enables cost-effective utilization of gold and palladium on FOWLP designs.
