High-throw DC acid copper plating solutions for enhanced performance, reliability, and versatility in advanced mid-aspect ratio boards.
Achieve pulse plating-like performance without the cost of upgrading to pulse equipment. Our high-throw Direct Copper (DC) plating systems deliver unmatched throwing power, uniform deposits, and higher current densities for complex, high-aspect ratio designs.
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Ensure reliable plating for thick, multi-layer PCBs with PPR solutions, offering uniform coverage of high-aspect-ratio through-holes.
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Learn MoreIntegrated Solutions
We offer a full range of electrolytic copper metallization solutions, circuit formation, and final finishes for Printed Circuit Board (PCB) and Integrated Circuit (IC) substrate fabrication.
Sustainability
Our solutions enable improved metal selectivity, waste reduction, and higher manufacturing yields, helping customers achieve sustainable production goals.
Reliability
Our electrolytic copper metallization solutions are proven to deliver reliability across blind microvias, X-vias and high-aspect ratio through-holes.
High-throw DC plating is a direct current acid copper plating process that offers superior throwing power, enabling uniform copper deposition in deep or complex features, such as through-holes with high-aspect ratios, without the need for pulse plating equipment.
High-throw DC solutions, such as MacuSpec HT 360, plate copper with exceptional brightness, ductility, and uniformity across a wide range of current densities. This results in improved throughput, broader operating windows, and reduced surface copper build-up, making it ideal for advanced printed circuit boards (PCBs).
High-throw DC plating solutions, like MacuSpec HT 360, allow current densities from 5 to 30 ASF. This range provides flexibility in plating thick copper layers and complex geometries while maintaining high throughput.
High-throw DC plating delivers performance comparable to pulse plating, particularly for complex designs, without the need for additional pulse rectification equipment. It offers superior throwing power, ensuring uniform plating in deep or high-aspect ratio holes.
High-throw DC plating can handle aspect ratios of up to 15:1, ensuring effective copper deposition in deep vias or holes. This makes it an ideal solution for fabricators working with advanced multi-layer boards or High Density Interconnect (HDI) designs.
