Explore Products for Wafer Bumping
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MICROFAB® CU1000
High-speed copper plating process for copper pillars in flip chip packages, microbumps in 3D interconnects, and RDL.
Contact UsMICROFAB® CUMSA100
High-purity electroplating process produces equiaxed-grained matte copper deposits for bump/pillar fabrication.
Contact UsMICROFAB® GSW-100
Acid copper plating process engineered to produce low-stress, pure copper deposits.
Contact UsMICROFAB® GSW-200
Unique acid copper plating system designed for filling blind vias across various geometries.
Contact UsMICROFAB® MP-2500
High-speed copper plating process provides exceptional Within-Die and Within-Feature uniformity for mega pillar applications.
DiscoverMICROFAB® Pure BP
Pure copper process with high KV resistance, engineered for copper pillar, copper stud and Under-Bump Metallization (UBM) applications.
Contact UsMICROFAB® SC
High-speed copper plating process for copper pillars in flip chip packages, copper microbumps in 3D interconnects, and RDL.
Contact UsMICROFAB® SC-32
Acid copper plating process offers excellent throwing power, improved leveling characteristics, and ductile, low-stress deposits.
Contact UsMICROFAB® SC-40
High-speed copper plating process enables flat bump shape, engineered for high-speed pillar, copper stud, and UBM applications.
Contact UsMICROFAB® SC-40 PLUS
Next-generation high-speed copper plating process delivers high-purity deposits with cutting-edge uniformity.
DiscoverMICROFAB® SC-50
High-speed copper plating process delivers accurate bump height uniformity and bump shape control.
Contact UsMICROFAB® SN-300/302
High-speed low-alpha pure tin plating process produces compact grain structures and uniform surface morphology.
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