Hybrid bonding solutions for optimized pitch reduction, power efficiency, and reliability in advanced interconnect applications.
Our hybrid bonding solutions, including NOVAFAB® NANOTWIN Cu, enable superior mechanical and electrical properties, enhancing performance in Die-to-Die (D2D), Die-to-Wafer (D2W), and Redistribution Layer (RDL). Electromigration resistance and superior bonding make it ideal for reduced pitch sizes.
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We are industry leaders in providing innovative, high-performance advanced interconnect metallization solutions that empower our customers to achieve superior results.
Reliability
Engineered for superior quality and performance, our solutions enable customers to achieve exceptional yield for complex packages.
Sustainability
Our expertise and innovative interconnect metallization solutions are designed to support customers in achieving their Environmental, Health, and Safety (EH&S) objectives.
Hybrid bonding is a process used in advanced packaging to connect semiconductor components. It involves Cu-to-Cu direct bonding, eliminating the need for solder. The process improves mechanical strength, thermal dissipation, and electrical performance while overcoming scaling issues related to interconnects in reduced pitch sizes.
NOVAFAB NANOTWIN Cu offers superior mechanical and electrical properties for hybrid bonding. It improves electromigration resistance, making it ideal for reduced pitch sizes. This solution enhances performance in D2D, D2W, and RDL processes, offering greater reliability and better thermal management.
Our hybrid bonding solutions are engineered to address the unique challenges of hybrid bonding, utilizing grain-engineered films to solve the unique challenges of hybrid bonding.
Our NOVAFAB NANOTWIN Cu system creates a highly textured <111> grain structure with an optimal orientation to enable a superior bond.
Our NOVAFAB NANOTWIN Cu seamlessly integrates into existing processes, offered as a ready-to-use system with minimal complexity. With just one additive required for easy bath control and maintenance, the system ensures straightforward implementation and consistent performance in established workflows.
