Portfolio of advanced solutions for enhanced uniformity, coplanarity, reliability, and precision for advanced packaging.
Featuring high-speed copper pillar plating, boric acid-free barrier plating technologies, and simultaneous via fill/Redistribution Layer (RDL) metallization, our Panel Level Packaging (PLP) portfolio provides unmatched precision, and reliability for next generation 2.5D and 3D designs.
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Enable advanced IC substrates with innovative and robust via filling, RDLs, through-hole filling, and panel-level packaging solutions.
Learn MoreDrive innovation with our copper adhesion promoters, delivering consistent bonding and precision etching for IC substrate excellence.
Learn MoreMeet OEM standards with high-performance finishes that enhance solderability and gold wire bonding.
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Produce high-density Integrated Circuit (IC) substrates with our family of semi-additive, high-performance buildup processes.
Learn MoreIntegrated Solutions
From copper pillar plating to etching processes, our comprehensive portfolio supports the fabrication of today’s advanced packaging applications.
Sustainability
Our pioneering technologies use fewer hazardous materials and reduce water and power consumption, helping our customers meet their sustainability goals.
Reliability
We offer specialty processes for Panel Level Packaging applications, enhancing reliability for advanced architectures and ensuring long-term performance.
As high-performance computing for Artificial Intelligence (AI) applications drives demand for higher bandwidth, power efficiency, and I/O density, conventional packaging methods are reaching their limits. Panel Level Packaging (PLP) delivers the required scalability, yield, and cost efficiency essential for next-generation devices.
The rise of AI demands greater chip processing capacity and I/O density. Our Panel Level Packaging chemistries enable reliable copper pillar, barrier layer, and RDL metallization with high uniformity, coplanarity, and throughput to meet these advanced architecture requirements.
Systek SCP 100 addresses uniformity challenges by delivering high-speed copper pillar plating (up to 2.5 μm/min) with excellent flatness, coplanarity, and precision.
Systek BAF Ni is a boric acid-free electroplating process that delivers pure, ductile, low-stress nickel deposits with excellent coplanarity, enabling Environment Health & Safety (EH&S) compliance while enhancing reliability. It’s robust barrier layer prevents Intermetallic Compound (IMC) formation and voiding for stronger solder joints.
Designed for fan-out and 3D integrations, Systek VTP 100 achieves bottom-up via filling and uniform line profiles, even across dense layouts, at plating speeds up to 7.5 ASD. It enables consistent I/O redistribution for higher-density, compact package designs.
Systek HCP 100 offers extremely fast plating rates of 8 μm/min while maintaining excellent coplanarity and low Kirkendall Voiding (KV). Its superior Within-die (WID) and Within-feature (WIF) uniformity ensures strong mechanical performance and high yield for advanced interconnect applications.
