Solutions which span the entire process of building leadframe based packages from leadframe roughening to enhancing sidewall solderability.
Achieve MSL-1 performance and reliability with our integrated leadframe adhesion promoters. From leadframe roughening to improved sidewall solderability, our solutions are specifically tailored for evolving Quad Flat No-leads (QFN) and Dual In-Line Package (DIP) packages in high reliability automotive and advanced electronic applications.
![cooper_pattern_0001[71]](/sites/default/files/styles/story/public/2025-06/cooper_pattern_0001%5B71%5D.png?itok=DdhpdbZK)
We are here to help you. Please feel free to contact us with questions, comments or feedback.
Optimize PCB and leadframe chip packaging with our high-speed, clean ammoniacal etchants, improving performance for next-gen designs.
Learn MoreEnsure robust reliability for high-speed, low-loss applications with our wide range of engineered adhesion promoters.
Learn MoreOptimized molded interconnect device plating solutions that deliver precise selectivity, high yields, and ease of use.
Learn MoreAchieve a reliable foundation for superior PCB fabrication with our comprehensive chemistries, from dry film adhesion to final finish.
Learn MoreEnsure superior adhesion of solder masks and dry films with our solutions, delivering strong, reliable bonds.
Learn More
Integrated Solutions
From primary metallization to final finishes, our integrated circuit formation solutions optimize Printed Circuit Board (PCB) fabrication, enhancing both reliability and performance.
Sustainability
Our pioneering technologies reduce the use of hazardous materials while minimizing water and power consumption, enabling our customers to achieve their Environment Health & Safety (EH&S) goals.
Reliability
Our copper adhesion promotion and innerlayer bonding technologies are proven to deliver consistent reliability throughout the circuit formation process.
Our leadframe adhesion promoters enhance the performance and reliability of QFN and DIP packages to meet the rigorous demands of modern electronics, especially in automotive applications.
PackageBond is a proven system designed to improve adhesion between the epoxy mold compound and copper leadframe, ensuring MSL-1 reliability under intense lead-free circuit assembly temperatures.
By micro-roughening the copper surface and depositing an organometallic coating, PackageBond prevents delamination due to moisture ingress or Coefficient of Thermal Expansion (CTE) mismatch.
No, PackageBond preserves the integrity of Ag or Ni/Pd/Au plated leadframes, ensuring compatibility with die attach adhesives and strong wire bonds.
Our solutions deliver superior reliability, Automated Optical Inspection (AOI) friendly soldering, long-term delamination protection, and advanced functionality integration for next-generation electronic applications.
