Advanced Solder Pastes and solutions for interconnecting semiconductor electronics packages, from laminate to leadframe packaging.
Our solder pastes are available in water-soluble and no-clean chemistries and can be custom formulated with our broad portfolio of alloys. Our advanced solders are suitable for the evolving challenges encountered in fine pitch, and ultra-fine pitch applications like Heterogeneous packaging.
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Learn MoreIntegrated Solutions
Our integrated interconnect semiconductor solder paste solutions deliver high-performance, tailored materials for fine-pitch and ultra-fine-pitch advanced packaging. Designed to support precision printing, dispensing, and high-yield assembly, these solder pastes enhance interconnect reliability and process efficiency while enabling lead-free, sustainable semiconductor manufacturing with reduced environmental impact.
Sustainability
Our innovative, lead-free semiconductor solder paste products reduce waste, lower material consumption, and minimize environmental impact by enabling efficient, high-yield assembly processes. Designed to align with RoHS-compliant and compliance-focused manufacturing goals, these advanced interconnect materials support resource-efficient formulations, improved process efficiency, and sustainable semiconductor packaging aligned with circular economy and EH&S objectives.
Reliability
Our dependable semiconductor solder paste solutions improve print consistency, solder joint quality, and assembly yield in fine-pitch and ultra-fine-pitch semiconductor packaging applications. Engineered for consistent, high-yield performance, they minimize defects and process variation while delivering repeatable quality, supply chain stability, and robust reliability for advanced semiconductor assembly.
Solder paste is used in semiconductor and electronics manufacturing to attach components to circuit boards and packages, creating precise electrical and mechanical connections. In SMT assembly, it supports fine-pitch printing, high-yield manufacturing, and reliable interconnect formation, enabling durable performance in advanced semiconductor and PCB applications.
Yes, lead-free solder paste options are available for semiconductor and electronics assembly. Our advanced lead-free formulations are designed to meet RoHS requirements, delivering strong solder joint reliability and high-yield interconnect performance while supporting sustainability and regulatory compliance. Product-level specifications should be reviewed for the exact alloy and application to confirm performance and compliance requirements.
Solder paste should be stored refrigerated, typically at 2–10°C, in sealed packaging to preserve shelf life, prevent oxidation, and maintain optimal print performance. Before use, allow the paste to reach room temperature in accordance with product guidance to ensure consistent stencil printing, reliable deposition, and high-quality semiconductor and SMT assembly results.
Yes, our solder pastes are designed to meet Restriction of Hazardous Substances (RoHS) requirements, and lead-free options are available for semiconductor and SMT assembly in global electronics manufacturing. These formulations support regulatory compliance, environmental safety, and high-reliability interconnect performance. Product-level compliance and alloy selection should be confirmed for the specific semiconductor packaging or SMT process to ensure alignment with application requirements.
Solder paste is widely used in semiconductor packaging, electronics manufacturing, automotive electronics, aerospace, telecommunications, and medical device production. It enables high-precision SMT assembly, fine-pitch printing, and reliable PCB interconnects, supporting durable, high-yield solder joints for advanced and mission-critical semiconductor and electronic applications.
