Discover our high-performance copper via filling designed for any metallization challenge.
Achieve exceptional copper via filling with our MacuSpec™ VF, AVF, and VF-TH series, industry-proven solutions that deliver unmatched stability and reliable performance, even in complex High-Density Interconnect (HDI) applications.
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Create advanced mid-aspect-ratio boards with high-throw DC acid copper plating that boosts performance, reliability, and versatility.
Learn MoreEnsure reliable plating for thick, multi-layer PCBs with PPR solutions, offering uniform coverage of high-aspect-ratio through-holes.
Learn MoreIntegrated Solutions
Our comprehensive suite of electrolytic copper metallization solutions, circuit formation, and final finishes offers an integrated solution for Printed Circuit Board (PCB) and Integrated Circuit (IC) substrate fabrication.
Sustainability
We provide solutions for greater metal selectivity, waste reduction, and higher manufacturing yields helping customers achieve sustainable production goals.
Reliability
Our electrolytic copper metallization solutions are proven to deliver reliability across blind microvias, X-vias, and high-aspect ratio through-holes.
Electrolytic copper via filling is a process that fills microvias in printed circuit boards (PCBs) with copper to enhance durability, conductivity, and overall board stability. This process is essential for high-density interconnect (HDI) boards where reliability and structural integrity are crucial.
The MacuSpec VF Series provides stable, consistent copper via filling with proven reliability in high-density applications worldwide. It offers minimal surface copper and meets Institute of Printed Circuit Boards (IPC) standards, ensuring top-tier performance for HDI devices.
Yes, the MacuSpec VF-TH Series can fill vias while plating through-holes in one bath, supporting aspect ratios up to 6:1. This dual-function capability reduces steps and improves efficiency without sacrificing reliability.
The MacuSpec AVF Series offers precise, repeatable copper via filling for a range of micro-via sizes, allowing minimal surface copper under varied plating conditions. This series meets Institute of IPC standards, ensuring reliable performance in HDI applications.
MacuSpec VF-TH copper filling deposits meet IPC 6012D, DS, and 6013D standards, including tensile strength of at least 40,000 PSI and elongation over 18%, ensuring high durability and performance in demanding applications.
