Explore Products for ENIG
Have a question? Let us help you.
We are here to help you. Please feel free to contact us with questions, comments or feedback.
Exceed IPC quality standards with our ENIG solutions, delivering exceptional performance and the lowest total cost of ownership.
With precise gold thickness control and improved distribution, Affinity™ Electroless Nickel/Immersion Gold (ENIG) reduces gold consumption while delivering outstanding stability and corrosion resistance.
We are here to help you. Please feel free to contact us with questions, comments or feedback.
Achieve Six Sigma assembly performance and exceptional reliability with our ENEPIG corrosion-free, high-uniformity deposits.
Learn MoreSecure strong solder joints, touchpad functionality, and aluminum wire bonding with the industry's most trusted ImAg finishes.
Learn MoreGain consistent reliability and unmatched productivity with our trusted immersion tin final finishes.
Learn MoreExplore OEMs' preferred choice of OSP solutions, proven in production across diverse lead-free assembly applications.
Learn MoreIntegrated Solutions
Our thorough understanding of the interaction between final finishes and circuit board assembly materials allows us to deliver solutions that ensure the highest reliability.
Sustainability
With longer bath life, reduced precious metal content, lower operating temperatures, and dummy-free chemistry, we provide significant ESG benefits for fabricators and OEMs.
Reliability
Our product development process, guided by Six Sigma methodology, eliminates waste and enhances reliability throughout development.
Affinity™ ENIG is optimized for tight control over nickel-phosphorous distribution and pad-to-pad gold thickness, exceeding the latest IPC 4552 standards. This low variation reduces gold consumption, minimizes costs, and ensures high reliability for critical applications.
Yes, Affinity™ ENIG plating meets the latest IPC 4552 A and B standards, ensuring high-quality, defect-free finishes with uniform gold thickness. This compliance guarantees reliable performance for both soldering and wire bonding applications.
Affinity™ ENIG’s low variation in gold thickness reduces gold consumption, making it a cost-effective solution for high-reliability Printed Circuit Boards (PCBs). Its advanced electroless nickel bath ensures stability, cutting operational costs by minimizing excessive gold usage.
The ENIG process creates a corrosion-resistant nickel barrier layer, topped with an immersion gold layer that protects against oxidation. Affinity™ ENIG provides a highly stable, durable finish, making it ideal for mission-critical electronic components.
ENIG finishes are perfect for High-Density Interconnect (HDI) boards, fine-pitch soldering, and applications requiring excellent thermal and corrosion resistance. Affinity™ ENIG is specifically designed for critical PCB applications where reliability is essential.