Optimize PCB and leadframe-based chip packaging with our high-speed, clean ammoniacal etchants for superior performance.
Achieve exceptional quality in Printed Circuit Board (PCB) and chip packaging with our high-speed, highly buffered ammoniacal etchants, engineered for stable process control and high throughput.
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Ensure robust reliability for high-speed, low-loss applications with our wide range of engineered adhesion promoters.
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Integrated Solutions
From primary metallization to final finishes, our integrated circuit formation solutions optimize PCB fabrication, enhancing both reliability and performance.
Sustainability
Our pioneering technologies reduce the use of hazardous materials and minimize water and power consumption, helping our customers achieve their Environment Health & Safety (EH&S) goals.
Reliability
Our copper adhesion promotion and innerlayer bonding technologies are proven to deliver consistent reliability throughout the circuit formation process.
Ammoniacal etchants are used in PCB manufacturing to remove copper foil from the surface of the panel to form the external circuit pattern.
Ammoniacal etchants provide precise copper removal of saw burrs from the edges of the leadframe.
Yes, ammoniacal etchants are optimized for leadframe based chip packaging processes, offering high-speed continuous etching ideal for high-density packaging needs.
Ammoniacal etching is not used on inner layers.
Automated chemical control of the etchant chemistry keeps the chemistry at a steady state so process outputs are always consistent.
