Optimized molded interconnect device plating solutions that deliver precise selectivity, high yields, and ease of use.
Our molded interconnect device technology delivers precise selectivity and high yields for laser direct structured and double-shot Molded Interconnect Devices (MIDs). Copper, nickel, gold, and silver-plating solutions enable complex designs on cost-effective materials.
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Optimize PCB and leadframe chip packaging with our high-speed, clean ammoniacal etchants, improving performance for next-gen designs.
Learn MoreEnsure robust reliability for high-speed, low-loss applications with our wide range of engineered adhesion promoters.
Learn MoreAchieve MSL-1 performance and reliability with our adhesion promotors, from leadframe roughening to sidewall solderability enhancement.
Learn MoreAchieve a reliable foundation for superior PCB fabrication with our comprehensive chemistries, from dry film adhesion to final finish.
Learn MoreEnsure superior adhesion of solder masks and dry films with our solutions, delivering strong, reliable bonds.
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Reliability
For over 20 years, we have been the global leader in providing robust molded interconnect device (MID) manufacturing solutions.
Integrated Solutions
From primary metallization to final finishes, our integrated circuit formation solutions optimize Printed Circuit Board (PCB) fabrication, enhancing both reliability and performance.
Sustainability
Our pioneering technologies reduce the use of hazardous materials while minimizing water and power consumption, helping customers achieve their Environment Health & Safety (EH&S) goals.
MIDs integrate electronic and mechanical functions into a single 3D component, reducing size and weight. Commonly used in automotive, medical, and lighting industries, MIDs enable complex designs with cost-effective materials.
Molded interconnect device technology uses laser direct structuring on molded plastics to create conductive pathways. This technology allows precise placement of electronic circuits directly on the 3D structure, enhancing design flexibility.
Molded interconnect devices are typically made from materials like copper, nickel, gold, and silver, each offering unique benefits. Our MID solutions enable these metals to adhere effectively to low-cost molding composites, ensuring high performance across varied applications.
Our MID plating solutions offer high yields, precise selectivity, and compatibility with laser direct structured and double-shot methods. Our solutions provide steady plating rates and long-lasting bath performance, making MIDs efficient and reliable for complex applications.
With growing needs in automotive, medical, and lighting applications, MID technology offers the flexibility and integration needed for advanced electronic components. This technology supports cost-effective designs, enabling diverse new applications.
