PPR solutions ensure reliable, efficient plating for thick, multi-layer PCBs with uniform coverage of high-aspect ratio through-holes.
Periodic Pulse Reverse acid copper plating processes offer exceptional thickness control for complex boards while reducing copper consumption, ensuring efficient and cost-effective plating for mid-to-high aspect ratios.
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Create advanced mid-aspect-ratio boards with high-throw DC acid copper plating that boosts performance, reliability, and versatility.
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Learn MoreIntegrated Solutions
A comprehensive suite of electrolytic copper metallization solutions, circuit formation, and final finishes offers an integrated solution for Printed Circuit Board (PCB) and Integrated Circuit (IC) substrate fabrication.
Sustainability
Providing solutions for greater metal selectivity, waste reduction, and higher manufacturing yields helps our customers achieve their sustainable production goals.
Reliability
Our electrolytic copper metallization solutions are proven to deliver reliability across blind microvias, X-vias, and high-aspect ratio through-holes.
Periodic pulse reverse plating is a plating method that alternates between forward and reverse current pulses, achieving precise thickness control, higher uniformity, and superior filling in high-aspect ratio through-holes and blind vias on circuit boards.
Periodic pulse reverse plating improves deposit uniformity in high-aspect ratio through-holes by enhancing throwing power and layer thickness control, making it ideal for complex, thick circuit boards with many layers.
Unlike traditional Direct Current (DC) plating, periodic pulse reverse plating reduces over-plating, improves thickness control in vias and through-holes, and decreases surface copper, allowing for higher performance and cost efficiency in complex board designs.
Periodic pulse reverse plating is ideal for circuit boards with high layer counts, complex designs, and high-aspect ratio through-holes, including advanced applications in telecommunications, aerospace, and automotive electronics.
Periodic pulse reverse plating processes offer high flexibility, supporting a wide current density range of 5 to 30 ASF, enabling tailored thickness control and increased plating speed for various designs.
