Discover our family of SAP high-performance build-up processes, engineered for high-density IC substrates.
Our innovative Systek™ Semi-Additive Processes (SAP) deliver advanced adhesion, stress-free copper layers, and low-roughness surfaces—enabling new design possibilities for Integrated Circuit (IC) substrate Redistribution Layers (RDLs) and high-density build-up materials.
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Enable advanced IC substrates with innovative and robust via filling, RDLs, through-hole filling, and panel-level packaging solutions.
Learn MoreDrive innovation with our copper adhesion promoters, delivering consistent bonding and precision etching for IC substrate excellence.
Learn MoreMeet OEM standards with high-performance finishes that enhance solderability and gold wire bonding.
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Integrated Solutions
Our comprehensive portfolio, spanning primary metallization to final finishes, supports the fabrication of advanced IC substrates, meeting the demands of today’s most complex devices.
Sustainability
Our pioneering technology minimizes hazardous materials, reduces water and energy consumption, and helps customers achieve their Environmental, Health, and Safety (EH&S) goals.
Reliability
Our specialty processes are designed to enhance reliability, ensuring optimal performance for high-density IC substrate designs.
Systek™ SAP enhances adhesion, delivers stress-free copper layers, and achieves low surface roughness. These advantages ensure higher reliability, superior signal integrity, and compliance with stringent design requirements for high-density IC substrates.
Systek™ SAP supports high-density designs with precise copper deposition for fine lines, microvias, and RDLs. It ensures excellent adhesion and minimizes surface roughness for optimal performance.
Systek™ SAP combines advanced steps like desmear, conditioning, and activation with electroless copper plating to form a stress-free, high-performance seed layer, optimized for complex IC substrate designs.
Yes, Systek™ SAP supports flexible materials with tailored process flows for ultra-fine-line and flex substrates, ensuring excellent adhesion and high-quality plating to meet the demands of flexible IC designs.
The Systek™ SAP process is compatible with diverse materials, including glass, flex, and ultra-fine-line substrates, delivering optimal metallization for high-density, multi-layer IC designs.
