Ensure robust reliability for high-speed, low-loss applications with our range of engineered adhesion promoters.
Achieve optimal innerlayer adhesion with our advanced circuitry adhesion promoters. Engineered for a wide range of materials, our promoters preserve signal integrity, even in high-speed, low-loss applications.
We are here to help you. Please feel free to contact us with questions, comments or feedback.
Optimize PCB and leadframe chip packaging with our high-speed, clean ammoniacal etchants, improving performance for next-gen designs.
Learn MoreAchieve MSL-1 performance and reliability with our adhesion promotors, from leadframe roughening to sidewall solderability enhancement.
Learn MoreOptimized molded interconnect device plating solutions that deliver precise selectivity, high yields, and ease of use.
Learn MoreAchieve a reliable foundation for superior PCB fabrication with our comprehensive chemistries, from dry film adhesion to final finish.
Learn MoreEnsure superior adhesion of solder masks and dry films with our solutions, delivering strong, reliable bonds.
Learn More
Integrated Solutions
From primary metallization to final finishes, our integrated circuit formation solutions optimize Printed Circuit Board (PCB) fabrication, enhancing both reliability and performance.
Sustainability
Our pioneering technologies reduce the use of hazardous materials while minimizing water and power consumption, helping customers meet their Environment Health & Safety (EH&S) goals.
Reliability
Our copper adhesion promotion and innerlayer bonding technologies are proven to deliver consistent reliability throughout the circuit formation process.
Adhesion promoters are specialized surface treatments designed to enhance the bond between copper circuits and resin in Printed Circuit Boards (PCBs) or Integrated Circuit Substrates (ICS). They ensure long-term reliability, improving performance in a wide range of materials.
These promoters modify the copper surface to optimize adhesion between the numerous dielectric resin systems and the copper circuits. This treatment enhances the surface's ability to bond effectively, ensuring consistent, thermally reliable interfaces within the PCB or IC substrate.
Adhesion promoters are engineered to work with a wide range of resin systems, including standard, low-loss, high temperature, and flexible laminate systems ensuring optimal bonding in various applications such as high-speed electronics, medical, military/avionics, and IC substrates.
Adhesion promoters improve the bond between copper and resin while maintaining signal integrity. This is particularly important in high-speed PCBs, where signal loss or degradation can impact overall performance.
Yes, our circuitry adhesion promoters are specifically formulated to work with various copper foil types, including Very Low-Profile (VLP), Hyper Very Low-Profile (HVLP), and Rolled Annealed (RA) foil types ensuring optimal adhesion and performance.
