Ensure superior adhesion of solder masks and dry films, delivering strong, reliable bonds for high-performance PCB manufacturing.
Achieve superior adhesion with our advanced adhesion promoters, designed for solder mask and dry film or liquid photoresists. Choose our MultiPrep 200 copper adhesion promoter for uniform copper roughening, eliminating the need for scrubbing, and ensuring reliable bonds for microvias, ultra-fine features, and all final finishes.
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Learn MoreIntegrated Solutions
From primary metallization to final finishes, our integrated circuit formation solutions optimize Printed Circuit Board (PCB) fabrication, enhancing both reliability and performance.
Sustainability
Our pioneering technologies reduce the use of hazardous materials and minimize water and power consumption, helping customers meet their Environment Health & Safety (EH&S) goals.
Reliability
Our copper adhesion promotion and innerlayer bonding technologies are proven to deliver unmatched reliability throughout the circuit formation process.
Our advanced adhesion promoters are specifically designed for solder masks, dry films, and liquid photoresists on copper, ensuring superior bonding consistency.
MultiPrep 200 creates a rough, micro-etched copper surface that enhances adhesion to microvias, ultra-fine features, and via fill ensuring unmatched reliability.
Yes, it works seamlessly with all final finish chemistries, including Electroless Nickel/Immersion Gold (ENIG), immersion silver, Organic Solderability Preservative (OSP), and immersion tin.
Absolutely, it is ideal for microvias, ultra-fine structures, and intricate circuit boards, delivering uniformity and clean cosmetics.
Backed by decades of etching expertise, MultiPrep 200 offers unmatched reliability, compatibility, and performance across a wide range of applications.
