Connect
Our superior connection technologies facilitate efficient and reliable electrical and mechanical connections.
Strengthening Circuit Connectivity
We enable reliable circuit pathways that enhance connectivity in high-density designs. Our board-level assembly, circuit fabrication, standard die attach, top-side attach, and package attach solutions create strong, durable bonds with excellent electrical and thermal conductivity for advanced performance.
When applied in circuit board and semiconductor assembly, Printed Circuit Board (PCB) fabrication, and smart surface applications, these technologies optimize functionality and structural integrity, reinforcing our leadership in electronics manufacturing.
Solutions for Every Stage of the Electronics Supply Chain
Connecting with Resilience: Advancing High-Density Designs with Durable and Reliable Circuit Pathways.
Enhancing Durability, Conductivity, and Reliability
Stronger, Durable Bonds
Our integrated solutions for circuit board and semiconductor assembly create stronger, more durable bonds.
Optimize Thermal Conductivity
Our sintering and soldering materials, combined with our thermal interface solutions, enhance thermal conductivity and minimize electrical resistance.
Advanced Board-Level Assembly
Integrating our trusted ALPHA®, Electrolube®, and Kester® materials enhances PCB design, reliability, manufacturing efficiency, and sustainability.
Explore Our Connect Solutions
Circuit Board Assembly
Driving PCB technology with leading-edge electronic materials for high-reliability in complex Circuit Board Assemblies (CBAs).
Learn MoreCircuitry Solutions
Enabling next-gen technology with innovative specialty chemistries and materials for the most complex PCB and IC substrate designs.
Learn MoreFilm & Smart Surface Solutions
Functional Films & Smart Surfaces for Seamless Interfaces.
Learn MoreFrequently Asked Questions
“How can I ensure consistent and reliable electrical connections in advanced electronic assemblies?”
Achieving reliable electrical and mechanical connections in miniaturized or high-density designs is increasingly complex — requiring advanced connection materials that perform under thermal and mechanical stress.