Our RDL solutions deliver high-purity deposits, conformal seed filling and adjustable surface roughness for advanced semiconductors.
Unlock superior package connectivity with our Redistribution Layer (RDL) solutions. Our high-purity gold deposits with superior step coverage and adjustable surface roughness enhance solderability and conductivity, optimizing 2.5D and 3D wafer level packaging designs.
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Learn MoreIntegrated Solutions
Our complete range of pre-plate, strike, and plating solutions ensures superior results for compound semiconductor applications.
Sustainability
Non-cyanide gold plating solutions support the achievement of Environment Health & Safety (EH&S) goals and maintain performance in compound semiconductor applications.
Reliability
Unmatched corrosion resistance, high thermal stability, and improved adhesion are delivered through our portfolio of compound semiconductor solutions.
A Redistribution Layer (RDL) is used to reroute I/O connections in semiconductor packaging. It involves adding dielectric and metal layers to a wafer to re-route the I/O pitch, enabling communication between chips in advanced packaging designs like 2.5D, 3D, and wafer level packaging.
Our gold solutions enable high-purity gold deposits, superior step coverage, and uniform via filling with a conformal seed, enhancing the overall performance of the redistribution layer (RDL) for reliable electrical connections and better signal integrity.
Our gold solutions provide superior via fill with a conformal seed, ensuring excellent step coverage and reliable electrical paths in RDL applications. This leads to improved performance, higher yield, and more efficient manufacturing of advanced semiconductor packages.
Our gold solutions ensure superior step coverage in RDL layers, providing uniform deposition even in challenging geometries. This results in better electrical performance, increased reliability, and enhanced manufacturing yields for high-density semiconductor packaging.
Our gold RDL solutions feature adjustable surface roughness, which ensures optimal solderability and enhanced bonding between layers. This helps in achieving a uniform surface for solder bumps, improving overall package reliability and performance.
