Damascene
Enable advanced-node manufacturing with dual-damascene processes for bottom-up copper electroplating and void-free metallization.
Learn MoreAdvanced Interconnect Metallization for Wafer Level Packaging
Advanced interconnect metallization wafer level packaging customized solutions deliver high reliability and performance at the lowest cost of ownership for tomorrow’s cutting-edge technologies.
Elevate Performance and Reliability
Enhance the performance of your next-generation packages with our advanced interconnect metallization solutions. Engineered for high reliability, exceptional uniformity, and robust performance, our chemistries support future technologies while enabling a flexible development approach to accelerate time to market and optimize cost efficiency.
Enabling Complex Package Designs
Optimize Next-Gen Technologies with Advanced Packaging Solutions
Innovative processes for Redistribution Layer (RDL), copper pillars, and solder bumps that optimize thermal, electrical, and structural performance in future technologies.
Enhance Reliability and Performance of Complex Packages
Our advanced interconnect technologies enable high coplanarity, high throughput, and void elimination for enhanced reliability and performance of complex packages.
Accelerate Innovation with Customer Collaboration
Through close collaboration, we provide customized solutions tailored to specific performance needs, accelerating innovation for next-generation packages.
Ensure Fast, Agile Development Cycles
Our flexible development approach ensures faster time-to-market, giving customers a competitive edge with advanced, future-ready packaging solutions.
Maximize Cost Efficiency, Minimize Waste
Reduce total cost of ownership with optimized wafer level packaging solutions that minimize waste, meet Environment Health & Safety (EH&S) goals, and enhance production speeds.
Explore Categories
Hybrid Bonding
Optimize pitch reduction, power efficiency, and reliability in advanced interconnect applications with our hybrid bonding solutions.
Learn MoreLow Alpha Materials
Enhance reliability in next-generation devices with our high-quality, sustainably sourced low-alpha tin materials.
Learn MoreRedistribution Layer (RDL)
Unlock best-in-class RDL performance with our RDL solutions, enabling efficient I/O pitch redistribution and advanced plating precision.
Learn MoreThrough-Silicon Via (TSV)
Fill TSVs efficiently with our copper plating process, delivering reliable bottom-up plating for complex, high-density packages.
Learn MoreWafer Bumping
Enhance reliability and performance in next-generation semiconductor packages with advanced wafer bumping metallization solutions.
Learn MoreWhy MacDermid Alpha?
Integrated Solutions
As industry leaders, we provide innovative, high-performance advanced interconnect metallization solutions that empower our customers to achieve superior wafer level packaging results.
Sustainability
Our expertise and innovative interconnect metallization solutions are designed to help customers achieve their environmental, health, and safety objectives.
Reliability
Engineered for superior quality and performance, our solutions enable customers to achieve exceptional yields in complex packages.
Featured Products
Frequently Asked Questions
What makes MacDermid Alpha's electroplating solutions unique compared to competitors?
Our solutions combine industry-leading performance, proven reliability, and customization options, backed by decades of expertise in metallization technologies.
Do your solutions meet industry standards for advanced nodes?
Yes, our products are optimized to meet the stringent requirements of advanced nodes <7nm, ensuring compatibility with cutting-edge semiconductor technologies.
What products do you offer for wafer level packaging?
We offer advanced electroplating solutions for RDLs, copper pillars, and solder bumps, tailored to meet the demands of wafer level packaging.