Interconnect
Our advanced interconnect solutions ensure robust and reliable connectivity.
Delivering Seamless Electrical Performance
Our metallization and wafer level packaging technologies enable complex, high-density interconnect designs. We provide advanced solutions for direct metallization of Printed Circuit Boards (PCB's), semi-additive copper metallization on IC substrates, and copper plating for Through Silicon Via (TSV) interconnects.
Our integrated metallization technology includes high-precision Redistribution Layer (RDL) plating and via filling, void-free fine-feature damascene processes, hybrid bonding, copper pillar plating, and backside metallization.
When applied in wafer-level packaging, PCB fabrication, and semiconductor assembly, our solutions deliver seamless electrical performance and long-term reliability, reinforcing our commitment to innovation and excellence in connectivity.
Solutions for Every Stage of the Electronics Supply Chain
Interconnecting with Precision: Advancing Wafer Level Packaging with Metallization Solutions
Advancing Performance, Efficiency, and Sustainability
Boost Performance
Our integrated solutions enhance performance by reducing pitch, supporting 2.5D and 3D packaging, increasing density, achieving 100% throwing power, and enabling heterogeneous integration.
Optimize Thermal Management
To effectively dissipate heat, it’s important to address thermal challenges across multiple aspects of the assembly. In the image above, we’ve highlighted how our backside metallization and hybrid bonding technologies provide exceptional thermal management.
Drive Sustainability
We enable sustainable PCB fabrication by meeting Restriction of Hazardous Substances (RoHS) standards, eliminating restricted materials, and reducing resource usage with precious metal-free primary metallization.
Explore our Interconnect Solutions
Circuitry Solutions
Enabling next-gen technology with innovative specialty chemistries and materials for the most complex PCB and IC substrate designs.
Learn MoreSemiconductor Assembly
Advancing innovative electronics with reliable bondline materials for electronics, photomasks, die attach, packaging and camera modules.
Learn MoreWafer Level Packaging
Maximizing reliability and performance of computer chips with leading-edge wafer level packaging for innovative semiconductor design.
Learn MoreFrequently Asked Questions
“How can I ensure high-reliability interconnects in complex, multilayer electronic designs?”
Modern interconnect requirements push the limits of traditional materials — leading to signal integrity issues, delamination, or failure in mission-critical applications without advanced solutions.