High-performance final finishes designed to meet OEM standards, with enhanced solderability and gold wire bondability for reliable, long-lasting performance.
We optimize Integrated Circuit (IC) substrate performance with our industry-leading final finishes. Our solutions, including ENTEK® Plus IC and Affinity™ Electroless Nickel Immersion Gold (ENIG) / Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG), provide uniform coating, precise thickness control, excellent wire bondability, and reliable solderability for high-performance, long-lasting results.
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Enable advanced IC substrates with innovative and robust via filling, RDLs, through-hole filling, and panel-level packaging solutions.
Learn MoreDrive innovation with our copper adhesion promoters, delivering consistent bonding and precision etching for IC substrate excellence.
Learn MoreProduce high-density Integrated Circuit (IC) substrates with our family of semi-additive, high-performance buildup processes.
Learn MoreIntegrated Solutions
From primary metallization to final finishes, our comprehensive portfolio supports the fabrication of today's advanced integrated circuit substrates.
Sustainability
Our pioneering technology uses fewer hazardous materials while reducing water and power consumption, helping customers meet their Environment Health & Safety (EH&S) goals.
Reliability
Our specialty processes enhance the reliability of integrated circuit substrates, ensuring high-density designs perform consistently and effectively.
ENTEK® Plus IC is a proven, metal-free Organic Solderability Preservative (OSP) final finish that selectively deposits on copper. It maintains both appearance and performance after multiple reflows, improving solder reliability and simplifying mixed-metal operations.
Affinity™ ENIG offers excellent solderability, with uniform nickel-phosphorous distribution and precise gold thickness control. It reduces Electroless Nickel (EN) corrosion and meets strict Institute of Printed Circuit Boards (IPC) standards, making it ideal for applications requiring long shelf life and cost-effective gold use.
Affinity™ ENEPIG deposits a nickel-palladium-gold surface that ensures reliable gold wire bonds and strong solder joints. Its chemically stable process reduces extraneous plating, with predictable palladium tank maintenance, making it ideal for sensitive IC assemblies.
Yes, ENTEK® Plus IC is compatible with mixed-metal applications. It selectively deposits on copper only, providing a highly controlled coating thickness that supports complex IC substrate designs and multiple reflow cycles, all while maintaining superior performance.
Affinity™ ENIG’s advanced technology ensures precise control over gold thickness, reducing pad-to-pad variation and driving cost savings. This control optimizes solder joint reliability, delivering consistent performance across IC substrates.
