Unlock best-in-class RDL performance with our RDL solutions, enabling efficient I/O pitch redistribution and advanced plating precision.
The MICROFAB® RDLV Series offers high-performance redistribution layer solutions with unmatched precision for plating and via filling across varied dimensions. Ideal for 3D and fan-out designs, it enables seamless I/O re-routing and uniform line profiles.
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Our expertise and innovative interconnect metallization solutions are designed to support customers in achieving their Environmental, Health, and Safety (Eh&S) objectives.
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Engineered for superior quality and performance, our solutions enable customers to achieve exceptional yield for complex packages.
Redistribution Layer (RDL) plating involves depositing dielectric and metal layers onto a wafer surface to modify the pitch and enable better alignment with external circuits. RDL plating is crucial for advanced packaging designs like fan-in, fan-out, 3D, and 2.5D integrations, allowing for higher I/O density, improved electrical performance, and compact form factors. This process supports innovations in high-performance semiconductor devices, enabling more reliable and efficient interconnections.
MICROFAB RDLV is designed for precision in 3D and fan-out applications, offering bottom-up via filling and uniform RDL line plating that ensures stability and efficiency across complex designs.
The MICROFAB RDLV Series supports simultaneous plating of RDL lines and bottom-up via filling, creating strong, uniform connections across a wide range of line, space, and via dimensions.
Our MICROFAB RDLV series is designed for 2-in-1 applications, capable of filling both lines and vias. The MICROFAB RDLV 50 series offers versatility for a wide range of vias, while the MICROFAB RDLV 60 series delivers improved uniformity for more consistent fill quality, addressing specific application needs with optimized performance.
MICROFAB RDLV systems are easily integrated into existing processes, as each system is a 3-additive solution that can be optimized to meet specific application requirements. This flexibility allows for tailored performance while maintaining a robust operating window, ensuring seamless integration and consistent results across various production environments.
