ENEPIG
Achieve Six Sigma assembly performance and exceptional reliability with our ENEPIG corrosion-free, high-uniformity deposits.
Learn MoreIndustry-leading final finish processes that enable reliability, durability and exceptional wire bonding and solderability.
Our surface finishes deliver high yields and enhanced functionality at the lowest cost of ownership in the industry. With both organic and metallic finish options, our solutions preserve solderability in even the most challenging applications.
Industry-leading surface finishes enable plating of fine features, maximizing yields and ensuring reliability in high-density, complex Printed Circuit Board (PCB) designs.
Designed for critical applications, our PCB surface finishes reduce solder fatigue, ensuring long-lasting, high-performance solder joints.
Electroless Nickel/Immersion Gold (ENIG) and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) systems are designed to exceed all Institute of Printed Circuit Boards (IPC) standards, offering high corrosion resistance and reliable performance for mission-critical electronics.
Our nickel-free finishes minimize insertion loss, supporting seamless data transmission in high-frequency applications.
Cyanide-free ENIG/ENEPIG options use low operating temperatures and long bath life, reducing waste and lowering costs for an environmentally sustainable solution.
Achieve Six Sigma assembly performance and exceptional reliability with our ENEPIG corrosion-free, high-uniformity deposits.
Learn MoreExceed IPC quality standards with our ENIG solutions, delivering exceptional performance and the lowest total cost of ownership.
Learn More
Secure strong solder joints, touchpad functionality, and aluminum wire bonding with the industry's most trusted ImAg finishes.
Learn MoreGain consistent reliability and unmatched productivity with our trusted immersion tin final finishes.
Learn MoreExplore OEMs' preferred choice of OSP solutions, proven in production across diverse lead-free assembly applications.
Learn MoreIntegrated Solutions
Our deep understanding of the interaction between final finishes and circuit board assembly materials enables us to deliver the highest reliability solutions.
Sustainability
With extended bath life, reduced precious metal content, lower operating temperatures, and dummy-free chemistry, our solutions offer significant ESG advantages for fabricators and OEMs.
Reliability
Product development driven by Six Sigma methodology minimizes waste and enhances reliability throughout the product development process.
Surface finishes are protective coatings applied to printed circuit boards, providing a solderable surface that withstands shipping, storage, and multiple reflow assembly operations.
For high-density PCBs, finishes like immersion tin, Organic Solderability Preservative (OSP), and ENIG are ideal, enabling precise plating and maintaining solderability on fine features. These finishes support high assembly yields and ease of fabrication—critical for complex, compact designs.
PCB surface finishes directly impact solder joint reliability by forming reliable Intermetallic Compound (IMC) compounds, ensuring consistent solder joint strength.
Fabricators must consider the PCB’s application, assembly complexity, frequency requirements, and environmental goals. Surface finishes should balance cost, reliability, ease of assembly, and performance to achieve optimal results in high-density or high-frequency designs.
ENIG and ENEPIG are renowned for their high corrosion resistance, long shelf life, and durability through multiple reflow assemblies. These systems offer exceptional durability and solderability, making them ideal for mission-critical applications that demand long-term reliability.