Assembly and Semiconductor Solutions for Telecommunications
We drive connectivity forward with advanced solutions for 5G today and pioneering technologies for the 6G future.
Flexible Hardware Design Options
We engineer integrated solutions that offer high electrochemical reliability, excellent thermal and electrical conductivity, high throughput, and low defects—ensuring superior performance and efficiency in your telecommunications electronic service hardware.
Telecommunications Circuitry Solutions
Antenna
Our low temperature co-fired ceramics (LTCC) product line delivers low-loss circuits ideal for reliable performance in harsh environments.
We provide circuit board fabrication and assembly materials that improve range and efficiency at higher frequencies by enabling component miniaturization and managing heat.
Data Centers
Our interconnecting, connecting, and protecting materials support component miniaturization while safeguarding Printed Circuit Boards (PCBs) against condensation and airborne contamination.
Network Infrastructure
Our thick film pastes, circuitry materials, and semiconductors are proven in the manufacturing of high-speed, reliable, and scalable telecommunications infrastructure.
Routers
By leveraging our circuitry solutions, designers can miniaturize components, maintain signal integrity, and ensure thermal control for continuous, high-power operation.
Switches
We offer Wafer Level Packaging (WLP) solutions that facilitate high-density integration, overcome mechanical stress and thermal management challenges, and improve component reliability.
Wireless Modems
As a proven supplier, our PCB and WLP fabrication solutions overcome manufacturing challenges for advanced designs, ensuring component durability and reliability.
Explore Categories
Circuit Board Assembly
Driving PCB technology with leading-edge electronic materials for high-reliability in complex Circuit Board Assemblies (CBAs).
Learn MoreCircuitry Solutions
Enabling next-gen technology with innovative specialty chemistries and materials for the most complex PCB and IC substrate designs.
Learn MoreSemiconductor Assembly
Advancing innovative electronics with reliable bondline materials for electronics, photomasks, die attach, packaging and camera modules.
Learn MoreWafer Level Packaging
Maximizing reliability and performance of computer chips with leading-edge wafer level packaging for innovative semiconductor design.
Learn MoreWhy MacDermid Alpha?
Integrated Solutions
Fabrication and assembly materials for optimized interconnection synergy.
Sustainability
Proven technology that delivers high fabrication yields.
Reliability
Solutions for component miniaturization design and enhanced durability.
Brochures
Explore our brochures for circuitry, circuit boards, packaging, semiconductor assembly, and smart surface solutions.
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Events
Visit us at these events to learn about our next-generation solutions for electronics design and manufacturing.
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Technical Data Sheets
Access the detailed specifications for all our products and solutions serving the electronics industry.
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