Explore Products for Display Driver Interface (DDI)
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Our high-hardness gold solutions for display driver applications enable superior bondability, reliability and thermal stability.
Our MICROFAB® AU3151 high-purity gold electroplating process enables proven reliability and bondability for display driver applications. It creates high-hardness gold bumps that resist changes in hardness throughout post-processing thermal events. Superior post-anneal bump properties allow for tighter bump pitches.
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We provide non-cyanide gold plating solutions that support Environment Health & Safety (EH&S) goals while maintaining performance in compound semiconductor applications.
Reliability
Achieve unmatched corrosion resistance, high thermal stability, and improved adhesion with our portfolio of compound semiconductor solutions.
Integrated Solutions
Our complete range of pre-plate, strike, and plating solutions ensures superior results for compound semiconductor applications.
A display driver, or display driver Integrated Circuit (IC), is an interface that controls voltages across display panels, enabling communication between a device’s microcontroller and its display. It’s essential for accurate control of visuals on devices like smartphones and tablets.
High-hardness gold electroplating, like in MICROFAB AU3151, enhances the reliability and bondability of display drivers. The gold bump's stable hardness ensures optimal & repeatable results in subsequent wire bonding processes. The stabilized grain structure has less spreading and bump flattening as the wire bonding process makes contact with the gold bump, and this effect enables tighter line & space requirements to be maintained.
MICROFAB AU3151’s high-hardness gold electroplating process offers durable, hard gold bumping that resists changes to the physical form of the gold bump. This ensures excellent repeatability during wire bonding processes, and is essential for high-performance display drivers in mobile and wearable devices.
Display drivers are used in a wide range of applications, including smartphones, tablets, and wearables. They help control and stabilize visual outputs across different display types, from Liquid Crystal Display (LCD) to Organic Light Emitting Diode (OLED), ensuring high-quality performance in each.
Gold bumping is a process where photo-defined patterns are electroplated with thick gold deposits. These electroplated pads are created to provide a wire bonding surface for the needed device interconnects. This high-hardness gold bump material, like in MICROFAB AU3151, provides durability and thermal stability essential for display quality and longevity.